i ntegrated c ircuits d ivision e 3 ds-CPC1968-r01 www.ixysic.com 1 characteristics features ? 5a load current with 5c/w heat sink ? low 0.35 ? on-resistance ? 500v p blocking voltage ? 2500v rms input/output isolation ? low thermal resistance (0.3 c/w) ? electrically non-conduc tive thermal pad for heat sink applications ? low drive power requirements ? arc-free with no snubbing circuits ? no emi/rfi generation ? machine insertable, wave solderable applications ? industrial controls / motor control ? robotics ? medical equipment?patient/equipment isolation ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? transportation equipment ? aerospace/defense approvals ? ul 508 recognized component: file e69938 pin configuration description the CPC1968 single-pole normally open (1-form-a) solid state power relay is rated for up to 5a continuous load current with a 5c/w heat sink. optically coupled mosfet technology enables the CPC1968 to provide 2500v rms of input to output isolation. the output, constructed with efficient mosfet switches and photovoltaic die, uses ixys integrated circuits division?s patented optomos architecture while the input, a highly efficient gaalas infrared led, provides the optically coupled control. the combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. the unique isoplus-264 package pioneered by ixys enables solid state relays to achieve the highest load current and power ratings. this package features a unique ixys process in which the silicon chips are soft soldered onto the direct copper bond (dcb) substrate instead of the traditional copper leadframe. the dcb ceramic, the same substrate used in high power modules, not only provides 2500v rms isolation but also very low thermal resistance (0.3 c/w). ordering information switching characteristics parameter rating units blocking voltage 500 v p load current, t a =25c: with 5c/w heat sink 5 a rms / a dc no heat sink 2 on-resistance 0.35 ? r ? jc 0.3 c/w part description CPC1968j isoplus-264 package (25 per tube) form-a i f i load 10% 90% t on t off CPC1968 isoplus?-264 power relay free datasheet http:///
i ntegrated c ircuits d ivision 2 www.ixysic.com r01 CPC1968 1 specifications 1.1 absolute maximum ratings @ 25c absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.2 electrical characteristics @ 25c 1 higher load currents possible with proper heat sinking. 2 measurement taken within 1 second of on-time. 3 for applications requiring high temperature operation (t c > 60oc) a led drive current of 20ma is recommended. symbol ratings units blocking voltage 500 v p reverse input voltage 5 v input control current 100 ma peak (10ms) 1 a input power dissipation 150 mw isolation voltage, input to output 2500 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c parameter conditions symbol minimum typical maximum units output characteristics load current 1 peak t ? 10ms -- 25 a p continuous no heat sink i l 2 continuous t c =25c 15 a rms / a dc continuous t c =99c i l(99) 7.1 on-resistance 2 i f =10ma, i l =1a r on - - 0.35 ? off-state leakage current v l =500v p i leak --1 ? a switching speeds tu r n - o n i f =20ma, v l =10v t on -4.620 ms tu r n - o f f t off -0.075 output capacitance v l =25v, f=1mhz c out -620- pf v l =1v, f=1mhz - 3500 - input characteristics input control current to activate 3 i l =1a i f -2.4510 ma input control current to deactivate - i f 0.6 - - ma input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r --10 ? a input/output characteristics capacitance, input-to-output - c i/o -1- pf free datasheet http:///
i ntegrated c ircuits d ivision r01 www.ixysic.com 3 CPC1968 2 thermal characteristics 2.1 thermal management device high current characterization was performed using kunze heat sink ku 1-159, phase change thermal interface material ku-alc 5, and transistor clip ku 4-499/1. this combination provided an approximate junction-to-ambient thermal resistance of 12.5c/w. 2.2 heat sink calculation higher load currents are possible by using lower thermal re sistance heat sink combinations. parameter conditions symbol minimum typical maximum units thermal resistance (junction to case) - r ? jc --0.3c/w thermal resistance (junction to ambient) free air r ? ja -33-c/w junction temperature (operating) - t j -40 - 110 c t j = j u nction temperat u re (c), t j 110c * t a = am b ient temperat u re (c) i l(99) = load c u rrent w ith case temperat u re @ 99c (a dc ) i l = desired operating load c u rrent (a dc ), i l i l(max) r jc = thermal resistance, j u nction to case (c/ w ) = 0.3c/ w r ca = thermal resistance of heat sink & thermal interface material , case to am b ient (c/ w ) p d(99) = maxim u m po w er dissipation w ith case temperat u re held at 99oc = 31 w * ele v ated j u nction temperat u re red u ces semicond u ctor lifetime. heat sink ratin g r ca = - r jc (t j - t a ) i l(99) 2 i l 2 ? p d(99) free datasheet http:///
i ntegrated c ircuits d ivision 4 www.ixysic.com r01 CPC1968 3 performance data @ 25c (unless otherwise noted) unless otherwise specified, all performance dat a was acquired without the use of a heat sink. the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in the written specifications, please cont act our application department. led forward volta g e (v) 1.215 1.220 1.225 1.230 1.235 1.240 device count (n) 0 5 10 15 20 25 30 35 40 typical led forward volta g e drop (n=50, i f =5ma) turn-on time (ms) 3.7 4.0 4.3 4.6 4.9 5.2 5.5 5. 8 device count (n) 0 5 10 15 20 25 typical turn-on time (n=50, i f =20ma, i l =1a) turn-off time (ms) 0.060 0.065 0.070 0.075 0.0 8 0 0.0 8 5 0.090 device count (n) 0 5 10 15 20 25 30 typical turn-off time (n=50, i f =20ma, i l =1a) on-resistance ( ) 0.260 0.265 0.270 0.275 0.2 8 0 0.2 8 5 0.290 device count (n) 0 5 10 15 20 25 typical on-resistance distribution (n=50, i f =10ma, i l =1a) blockin g volta g e (v p ) 540 545 550 555 560 565 570 575 device count (n) 0 5 10 15 20 25 typical blockin g volta g e distribution (n=50, i f =0ma, i l =10a) temperature (oc) -40 -20 0 20 40 60 8 0 100 led forward volta g e (v) 1.1 1.2 1.3 1.4 1.5 1.6 typical led forward volta g e drop vs. temperature i f =50ma i f =20ma i f =10ma i f =5ma led current (ma) 0 1020304050 turn-on time (ms) 0 5 10 15 20 typical turn-on time vs. led forward current (i l =1a) led current (ma) 0 1020304050 turn-off time (s) 60 65 70 75 8 0 typical turn-off time vs. led forward current (i l =1a) temperature (oc) -40 -20 0 20 40 60 8 0 100 turn-on time (ms) 4 6 8 10 12 14 typical turn-on time vs. temperature (v l =10v) i f =10ma i f =20ma temperature (oc) -40 -20 0 20 40 60 8 0 100 turn-off time (s) 40 45 50 55 60 65 70 75 8 0 typical turn-off time vs. temperature (v l =10v) i f =20ma i f =10ma led forward current (ma) 1.65 1.90 2.15 2.40 2.65 2.90 3.15 3.40 device count (n) 0 5 10 15 20 typical i f for switch operation (n=50, i l =1a) temperature (oc) -40 -20 0 20 40 60 8 0 100 led current (ma) 2 4 6 8 10 12 typical i f for switch operation vs. temperature (i l =1a) free datasheet http:///
i ntegrated c ircuits d ivision r01 www.ixysic.com 5 CPC1968 unless otherwise specified, all performance dat a was acquired without the use of a heat sink. the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in the written specifications, please cont act our application department. temperature (oc) -40 -20 0 20 40 60 8 0 100 on-resistance ( ) 0.20 0.25 0.30 0.35 0.40 0.45 0.50 typical on-resistance vs. temperature (i f =20ma, i l =1a) load volta g e (v) -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 load current (a) -6 -4 -2 0 2 4 6 typical load current vs. load volta g e (i f =20ma) temperature (oc) -40 -20 0 20 40 60 8 0 100 leaka g e current ( a) 0 5 10 15 20 25 30 35 40 leaka g e current vs. temperature measured across pins 1&2 (i f =0ma, v l =500v p ) load volta g e (v) 0 50 100 150 200 output capacitance (pf) 0 500 1000 1500 2000 2500 3000 3500 output capacitance vs. load volta g e (i f =0ma, f=1mhz) time 10 s 100 s 1ms 10ms 100ms 1s 10s 100s load current (a) 0 5 10 15 20 25 30 ener g y ratin g curve temperature (oc) 0204060 8 0 100 load current (a) 0 2 4 6 8 10 12 maximum load current vs. temperature (i f =20ma) heat sink 1oc/w 5oc/w 10oc/w free air temperature (oc) -40 -20 0 20 40 60 8 0 100 blockin g volta g e (v p ) 520 530 540 550 560 570 5 8 0 590 typical blockin g volta g e vs. temperature (i l =50 a) free datasheet http:///
i ntegrated c ircuits d ivision 6 www.ixysic.com r01 CPC1968 4 manufacturing information 4.1 moisture sensitivity all plastic encapsulated semiconductor packages are susc eptible to moisture ingression. ixys integrated circuits division clas sified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as establ ished by the listed specificati ons could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . 4.2 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . 4.3 reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. 4.4 board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated ci rcuits division employs the us e of silicone coating as an optical waveguide in many of its optically isolated produc ts, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine-bas ed or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ul trasonic energy should not be used. device moisture sensitivity level (msl) rating CPC1968j msl 1 device maximum temperature x time CPC1968j 245c for 30 seconds e 3 free datasheet http:///
i ntegrated c ircuits d ivision r01 www.ixysic.com 7 CPC1968 4.5 mechanical dimensions n ote: back-side heat sink meets 2500 v rms isolation to the pins. 26.162 0.254 (1.030 0.010) 19.914 0.254 (0.7 8 4 0.010) 20.396 0.50 8 (0. 8 03 0.020) 15.240 0.50 8 (0.600 0.020) 3. 8 10 0.254 (0.150 0.010) 2.362 0.3 8 1 (0.093 0.015) 0.635 0.076 (0.025 0.003) 2.794 0.127 (0.110 0.005) 5.029 0.127 (0.19 8 0.005) 1.1 8 1 0.076 (0.047 0.003) 1.930 0.3 8 1 (0.076 0.015) 17.221 0.254 (0.67 8 0.010) 20.600 0.254 (0. 8 11 0.010) 1.270 typ (0.050 typ) dime n sio n s mm (inches) for additional information please vi sit our website at: www.ixysic.com ixys integrated circuits division makes no representations or wa rranties with respect to the a ccuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity ar e expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and condit ions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringem ent of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits divisi on reserves the right to discontinue or make changes to its pr oducts at any time without notice. specification: ds-CPC1968-r01 ?copyright 2012, ixys integrated circuits division all rights reserved. printed in usa. 11/2/2012 free datasheet http:///
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